ASIC Package Engineering Intern/Co-Op (Undergrad | Summer, 2025 | Onsite/Hybrid)
AMD
On-site π’ 20 September
R&D, Innovation
Ontario, Canada 🇨🇦
Qualifications
Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicantsβ needs under the respective laws throughout all stages of the recruitment and selection process.Responsibilities
An exciting internship opportunity to make an immediate contribution to AMD's next generation of technology innovations awaits you! We have a multifaceted, high-energy work environment filled with a diverse group of employees, and we provide outstanding opportunities for developing your career. During your internship, our programs provide the opportunity to collaborate with AMD leaders, receive one-on-one mentorship, attend amazing networking events, and much more. Being part of AMD means receiving hands-on experience that will give you a competitive edge. Together We Advance your career! JOB DETAILS: Location: Markham, Ontario, Canada Onsite/Hybrid: This role requires the student to work full time 37.5 hrs a week, either in a hybrid or onsite work structure throughout the duration of the co-op/intern term. Duration: 16-months, May 05, 2025 - August 27, 2026 WHAT YOU WILL BE DOING: We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role β We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates We will assign you projects related to design verification implementation to ensure design performance, quality and efficiency Analyzing yield and defect metrics to ensure design performance and help improve the yield will be part of your responsibilities We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements WHO WE ARE LOOKING FOR: You are currently enrolled in a Canada based University into a Bachelor's degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field If you have knowledge / experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply β Course related to transmission lines and electric circuits Package, silicon or PCB design software Scripting languages β Perl / Python / SQL Semiconductor theory and packaging process/technology Data analytics and data visualization tools like PowerBI Note: By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you.Similar jobs
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Singapore 🇸🇬
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Student / Intern in Oracle Labs
On-site π’ 22 April
R&D, Innovation
Zurich, Switzerland 🇨🇭
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Product Development Engineering Intern/Co-Op (Undergrad | Summer, 2025 | Onsite/Hybrid)
On-site π’ 19 September
R&D, Innovation
Ontario, Canada 🇨🇦
2025 Applied Scientist Internship, Amazon University Talent Acquisition
On-site π’ 08 October
R&D, Innovation
Barcelona, Spain 🇪🇸 Madrid, Spain 🇪🇸
Research Scientist, Robotics – New College Grad 2025
On-site π’ 14 November
R&D, Innovation
Washington, United States 🇺🇸 California, United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Intern - ML and Computational Biology for the Immune System
Hybrid π‘π’ 04 November
R&D, Innovation
Washington, United States 🇺🇸
Research Sciences Intern
On-site π’ 24 October
R&D, Innovation
Karnataka, India 🇮🇳
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
ASIC Physical Design Intern - 2025
On-site π’ 15 October
R&D, Innovation
Hsinchu, Taiwan 🇹🇼
Research Intern - UX of AI
Hybrid π‘π’ 02 December
R&D, Innovation
Washington, United States 🇺🇸
Research Intern - Brain-Computer Interfaces
Hybrid π‘π’ 31 October
R&D, Innovation
Washington, United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Timing Methodology Engineer, Custom Circuits - New College Grad 2024
On-site π’ 11 September
R&D, Innovation
California, United States 🇺🇸
Research Intern - Audio and Acoustics
Hybrid π‘π’ 31 October
R&D, Innovation
Washington, United States 🇺🇸
Research Intern - Economics and Computation
Hybrid π‘π’ 30 October
R&D, Innovation
Massachusetts, United States 🇺🇸 Washington, United States 🇺🇸 New York, United States 🇺🇸
Applied Scientist (北京 2024-25校招 International Technology Team)
On-site π’ 14 August
R&D, Innovation
Beijing, China 🇨🇳
Mixed Signal Analog Circuit Designer (RDSS Intern)
On-site π’ 12 November
R&D, Innovation
Hsinchu, Taiwan 🇹🇼 Taipei, Taiwan 🇹🇼
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Hardware Engineering Intern/Co-Op (Undergrad | Summer 2025 | Onsite/Hybrid)
On-site π’ 05 September
R&D, Innovation
Ontario, Canada 🇨🇦
GPU Firmware Engineer (RDSS Intern)
On-site π’ 09 October
R&D, Innovation
Taipei, Taiwan 🇹🇼
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
NVIDIA 2025 Internships: Hardware Verification
Remote πππ 30 August
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸
Research Scientist L5, Algorithms Engineering
On-site π’ 23 July
R&D, Innovation
California, United States 🇺🇸
Mixed Signal Design Engineer - New College Grad 2024
On-site π’ 17 October
R&D, Innovation
California, United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Product Test Engineer (RDSS Intern) - 2025
On-site π’ 25 November
R&D, Innovation
Hsinchu, Taiwan 🇹🇼
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
2025 Applied Scientist Internship, Amazon University Talent Acquisition
On-site π’ 03 October
R&D, Innovation
London, United Kingdom 🇬🇧 Cambridge, United Kingdom 🇬🇧 Edinburgh, United Kingdom 🇬🇧
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Silicon Validation Engineer (RDSS Intern)
On-site π’ 22 October
R&D, Innovation
Taipei, Taiwan 🇹🇼
Research Scientist 4 - Content and Studio
On-site π’ 23 July
R&D, Innovation
California, United States 🇺🇸
Cambridge Internship Opportunities: Research Intern
Hybrid π‘π’ 02 December
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧
Research Intern - Mathematics
Hybrid π‘π’ 28 October
R&D, Innovation
Massachusetts, United States 🇺🇸
PhD Research Intern, Computer Vision and Deep Learning - 2025
Remote πππ 21 October
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸
GPU Performance Architect Intern - Summer 2025
On-site π’ 25 November
R&D, Innovation
California, United States 🇺🇸
Mixed Signal Design Engineer (RDSS Intern)
On-site π’ 15 November
R&D, Innovation
Taipei, Taiwan 🇹🇼 Hsinchu, Taiwan 🇹🇼
Research Intern - IMAIS Group: Situated Intelligence and Multimodal Interaction in the Physical World
Hybrid π‘π’ 01 November
R&D, Innovation
Washington, United States 🇺🇸
NVIDIA 2025 Internships: Mixed Signal / Circuit Design
On-site π’ 04 November
R&D, Innovation
California, United States 🇺🇸
Intern, Oncology Epidemiologist
On-site π’ 08 October
R&D, Innovation
United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Intern - IMAIS - Adaptive Closed-Loop Interaction
Hybrid π‘π’ 28 October
R&D, Innovation
Massachusetts, United States 🇺🇸
GPU Architecture Engineer - New College Grad 2024
On-site π’ 08 November
R&D, Innovation
California, United States 🇺🇸 Texas, United States 🇺🇸 North Carolina, United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Physical Design Engineer (RDSS Intern)
On-site π’ 17 October
R&D, Innovation
Hsinchu, Taiwan 🇹🇼
Research Intern - MSR Inclusive Futures Team
Hybrid π‘π’ 25 October
R&D, Innovation
Washington, United States 🇺🇸
Graphics Architect, Hardware - New College Grad 2025
On-site π’ 05 November
R&D, Innovation
California, United States 🇺🇸
Applied Deep Learning Research Intern
On-site π’ 02 December
R&D, Innovation
Helsinki, Finland 🇫🇮 Amsterdam, Netherlands 🇳🇱 Zurich, Switzerland 🇨🇭
Board Design Engineer, LDE - New College Graduate
On-site π’ 07 May
R&D, Innovation
Shenzhen, China 🇨🇳
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
PCB Layout Engineer - New College Graduate
On-site π’ 16 October
R&D, Innovation
Shenzhen, China 🇨🇳
Research Fellowship Opportunity
Hybrid π‘π’ 26 August
R&D, Innovation
Karnataka, India 🇮🇳
NVIDIA 2025 Internships: Hardware Physical Design / VLSI
Remote πππ 28 August
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸
Research Intern - Algorithms Group: Theory
Hybrid π‘π’ 06 November
R&D, Innovation
Washington, United States 🇺🇸
Research Intern - Gray Systems Lab
Hybrid π‘π’ 02 October
R&D, Innovation
Washington, United States 🇺🇸 Wisconsin, United States 🇺🇸 California, United States 🇺🇸
Research Intern - Action Models and Reinforcement Learning
Hybrid π‘π’ 15 August
R&D, Innovation
New York, United States 🇺🇸
Cambridge Research Intern – Generative Models for Video Games
Hybrid π‘π’ 18 November
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧
Power Architecture and Optimization Engineer – New College Grad 2024
On-site π’ 24 September
R&D, Innovation
California, United States 🇺🇸 Texas, United States 🇺🇸
Cambridge Internship Opportunities- Azure Research
Hybrid π‘π’ 06 November
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧
Mixed-Signal Circuit Design Engineer - New College Graduate
On-site π’ 06 December
R&D, Innovation
Hsinchu, Taiwan 🇹🇼 Taipei, Taiwan 🇹🇼
Power Methodology and Modeling Engineer - New College Grad 2024
On-site π’ 04 November
R&D, Innovation
California, United States 🇺🇸 Texas, United States 🇺🇸
Barcelona Research Intern – Gray Systems Lab
Hybrid π‘π’ 08 November
R&D, Innovation
Barcelona, Spain 🇪🇸
Hardware Design Verification Engineering Intern/Co-Op (Undergrad | Summer 2025 | Onsite/Hybrid)
On-site π’ 17 September
R&D, Innovation
British Columbia, Canada 🇨🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
2025 Co-Op: R&D Packaging
On-site π’ 29 August
R&D, Innovation
Texas, United States 🇺🇸 New York, United States 🇺🇸 Illinois, United States 🇺🇸
Service Process Innovation & Systems Support (INTERNSHIP)
Hybrid π‘π’ 08 August
R&D, Innovation
Milano, Italy 🇮🇹
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Intern - AI Networking - SPARC (Strategic Planning and Architecture)
Hybrid π‘π’ 03 December
R&D, Innovation
Washington, United States 🇺🇸 California, United States 🇺🇸
Research Intern - Innovation Market Analyst Intern
Hybrid π‘π’ 06 November
R&D, Innovation
Washington, United States 🇺🇸
Research Intern - AI-Assisted Game Creation
Hybrid π‘π’ 21 November
R&D, Innovation
Washington, United States 🇺🇸 California, United States 🇺🇸
NVIDIA 2025 Internships: Hardware ASIC Design
Remote πππ 28 August
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Silicon Solution Intern - 2025
On-site π’ 21 October
R&D, Innovation
Shanghai, China 🇨🇳
Research Intern - MSR AI Interaction and Learning
Hybrid π‘π’ 30 October
R&D, Innovation
Washington, United States 🇺🇸
Research Intern - Product Strategy Intern
Hybrid π‘π’ 18 November
R&D, Innovation
Washington, United States 🇺🇸
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
Research Assistant - PFE 2025
On-site π’ 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦
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