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ASIC Package Engineering Intern/Co-Op (Undergrad | Summer, 2025 | Onsite/Hybrid)

AMD

On-site 🏒 20 September
R&D, Innovation
Ontario, Canada 🇨🇦

WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_ An exciting internship opportunity to make an immediate contribution to AMD's next generation of technology innovations awaits you! We have a multifaceted, high-energy work environment filled with a diverse group of employees, and we provide outstanding opportunities for developing your career. During your internship, our programs provide the opportunity to collaborate with AMD leaders, receive one-on-one mentorship, attend amazing networking events, and much more. Being part of AMD means receiving hands-on experience that will give you a competitive edge. Together We Advance your career! JOB DETAILS: Location: Markham, Ontario, Canada Onsite/Hybrid: This role requires the student to work full time 37.5 hrs a week, either in a hybrid or onsite work structure throughout the duration of the co-op/intern term. Duration: 16-months, May 05, 2025 - August 27, 2026 WHAT YOU WILL BE DOING: We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role – We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates We will assign you projects related to design verification implementation to ensure design performance, quality and efficiency Analyzing yield and defect metrics to ensure design performance and help improve the yield will be part of your responsibilities We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements WHO WE ARE LOOKING FOR: You are currently enrolled in a Canada based University into a Bachelor's degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field If you have knowledge / experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply – Course related to transmission lines and electric circuits Package, silicon or PCB design software Scripting languages – Perl / Python / SQL Semiconductor theory and packaging process/technology Data analytics and data visualization tools like PowerBI Note: By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you. Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Qualifications

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Responsibilities

An exciting internship opportunity to make an immediate contribution to AMD's next generation of technology innovations awaits you! We have a multifaceted, high-energy work environment filled with a diverse group of employees, and we provide outstanding opportunities for developing your career. During your internship, our programs provide the opportunity to collaborate with AMD leaders, receive one-on-one mentorship, attend amazing networking events, and much more. Being part of AMD means receiving hands-on experience that will give you a competitive edge. Together We Advance your career! JOB DETAILS: Location: Markham, Ontario, Canada Onsite/Hybrid: This role requires the student to work full time 37.5 hrs a week, either in a hybrid or onsite work structure throughout the duration of the co-op/intern term. Duration: 16-months, May 05, 2025 - August 27, 2026 WHAT YOU WILL BE DOING: We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role – We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates We will assign you projects related to design verification implementation to ensure design performance, quality and efficiency Analyzing yield and defect metrics to ensure design performance and help improve the yield will be part of your responsibilities We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements WHO WE ARE LOOKING FOR: You are currently enrolled in a Canada based University into a Bachelor's degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field If you have knowledge / experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply – Course related to transmission lines and electric circuits Package, silicon or PCB design software Scripting languages – Perl / Python / SQL Semiconductor theory and packaging process/technology Data analytics and data visualization tools like PowerBI Note: By submitting your application, you are indicating your interest in AMD intern positions. We are recruiting for multiple positions, and if your experience aligns with any of our intern opportunities, a recruiter will contact you.
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On-site 🏒 31 October
R&D, Innovation
California, United States 🇺🇸

PhD Research Intern, Robotics and/or Autonomous Vehicles - 2025

Remote 🌎🌍🌏 22 October
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸 Washington, United States 🇺🇸

Research Intern - Undergraduate

Hybrid 🏑🏒 26 November
R&D, Innovation
Washington, United States 🇺🇸 New York, United States 🇺🇸 Massachusetts, United States 🇺🇸

Mixed Signal Design Engineer (RDSS Intern)

On-site 🏒 31 October
R&D, Innovation
Hsinchu, Taiwan 🇹🇼 Taipei, Taiwan 🇹🇼

Research Scientist, Digital Humans - New College Grad 2025

On-site 🏒 28 October
R&D, Innovation
California, United States 🇺🇸

Chip Design Engineer

On-site 🏒 22 September
R&D, Innovation
Tel Aviv, Israel 🇮🇱

PhD Research Intern, Large Language Models - 2025

Remote 🌎🌍🌏 21 October
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸

Signal and Power Integrity Engineer (RDSS Intern)

On-site 🏒 06 November
R&D, Innovation
Taipei, Taiwan 🇹🇼 Hsinchu, Taiwan 🇹🇼

Research Scientist, Design Automation - New College Grad 2025

On-site 🏒 28 October
R&D, Innovation
Texas, United States 🇺🇸 California, United States 🇺🇸

Research Scientist, Fundamental LLM Research for Knowledge, Reasoning, and Agents - New College Grad 2025

Remote 🌎🌍🌏 05 November
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Intern - MSR Intelligent Networked Systems

Hybrid 🏑🏒 23 October
R&D, Innovation
Washington, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

2025 Applied Scientist Internship, Amazon University Talent Acquisition

On-site 🏒 01 October
R&D, Innovation
Aachen, Germany 🇩🇪 Berlin, Germany 🇩🇪 Tuebingen, Germany 🇩🇪 Munich, Germany 🇩🇪

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Samsung’s Internship

Hybrid 🏑🏒 24 April
R&D, Innovation
Milano, Italy 🇮🇹

Research Intern - Biomedical Signal Processing

Hybrid 🏑🏒 14 November
R&D, Innovation
Washington, United States 🇺🇸

Cambridge Internship Opportunities – Research Intern

Hybrid 🏑🏒 06 November
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Intern - Biomedical AI for Precision Health

Hybrid 🏑🏒 04 November
R&D, Innovation
Washington, United States 🇺🇸 Massachusetts, United States 🇺🇸 California, United States 🇺🇸

DC Infra Electrical Eng Intern, Fleet Remediation Engineering

On-site 🏒 29 November
R&D, Innovation
Singapore 🇸🇬

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Student / Intern in Oracle Labs

On-site 🏒 22 April
R&D, Innovation
Zurich, Switzerland 🇨🇭

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Product Development Engineering Intern/Co-Op (Undergrad | Summer, 2025 | Onsite/Hybrid)

On-site 🏒 19 September
R&D, Innovation
Ontario, Canada 🇨🇦

2025 Applied Scientist Internship, Amazon University Talent Acquisition

On-site 🏒 08 October
R&D, Innovation
Barcelona, Spain 🇪🇸 Madrid, Spain 🇪🇸

Research Scientist, Robotics – New College Grad 2025

On-site 🏒 14 November
R&D, Innovation
Washington, United States 🇺🇸 California, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Intern - ML and Computational Biology for the Immune System

Hybrid 🏑🏒 04 November
R&D, Innovation
Washington, United States 🇺🇸

Research Sciences Intern

On-site 🏒 24 October
R&D, Innovation
Karnataka, India 🇮🇳

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

ASIC Physical Design Intern - 2025

On-site 🏒 15 October
R&D, Innovation
Hsinchu, Taiwan 🇹🇼

Research Intern - UX of AI

Hybrid 🏑🏒 02 December
R&D, Innovation
Washington, United States 🇺🇸

Research Intern - Brain-Computer Interfaces

Hybrid 🏑🏒 31 October
R&D, Innovation
Washington, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Timing Methodology Engineer, Custom Circuits - New College Grad 2024

On-site 🏒 11 September
R&D, Innovation
California, United States 🇺🇸

Research Intern - Audio and Acoustics

Hybrid 🏑🏒 31 October
R&D, Innovation
Washington, United States 🇺🇸

Research Intern - Economics and Computation

Hybrid 🏑🏒 30 October
R&D, Innovation
Massachusetts, United States 🇺🇸 Washington, United States 🇺🇸 New York, United States 🇺🇸

Applied Scientist (北京 2024-25校招 International Technology Team)

On-site 🏒 14 August
R&D, Innovation
Beijing, China 🇨🇳

Mixed Signal Analog Circuit Designer (RDSS Intern)

On-site 🏒 12 November
R&D, Innovation
Hsinchu, Taiwan 🇹🇼 Taipei, Taiwan 🇹🇼

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Hardware Engineering Intern/Co-Op (Undergrad | Summer 2025 | Onsite/Hybrid)

On-site 🏒 05 September
R&D, Innovation
Ontario, Canada 🇨🇦

GPU Firmware Engineer (RDSS Intern)

On-site 🏒 09 October
R&D, Innovation
Taipei, Taiwan 🇹🇼

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

NVIDIA 2025 Internships: Hardware Verification

Remote 🌎🌍🌏 30 August
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸

Research Scientist L5, Algorithms Engineering

On-site 🏒 23 July
R&D, Innovation
California, United States 🇺🇸

Mixed Signal Design Engineer - New College Grad 2024

On-site 🏒 17 October
R&D, Innovation
California, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Product Test Engineer (RDSS Intern) - 2025

On-site 🏒 25 November
R&D, Innovation
Hsinchu, Taiwan 🇹🇼

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

2025 Applied Scientist Internship, Amazon University Talent Acquisition

On-site 🏒 03 October
R&D, Innovation
London, United Kingdom 🇬🇧 Cambridge, United Kingdom 🇬🇧 Edinburgh, United Kingdom 🇬🇧

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Silicon Validation Engineer (RDSS Intern)

On-site 🏒 22 October
R&D, Innovation
Taipei, Taiwan 🇹🇼

Research Scientist 4 - Content and Studio

On-site 🏒 23 July
R&D, Innovation
California, United States 🇺🇸

Cambridge Internship Opportunities: Research Intern

Hybrid 🏑🏒 02 December
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧

Research Intern - Mathematics

Hybrid 🏑🏒 28 October
R&D, Innovation
Massachusetts, United States 🇺🇸

PhD Research Intern, Computer Vision and Deep Learning - 2025

Remote 🌎🌍🌏 21 October
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸

GPU Performance Architect Intern - Summer 2025

On-site 🏒 25 November
R&D, Innovation
California, United States 🇺🇸

Mixed Signal Design Engineer (RDSS Intern)

On-site 🏒 15 November
R&D, Innovation
Taipei, Taiwan 🇹🇼 Hsinchu, Taiwan 🇹🇼

Research Intern - IMAIS Group: Situated Intelligence and Multimodal Interaction in the Physical World

Hybrid 🏑🏒 01 November
R&D, Innovation
Washington, United States 🇺🇸

NVIDIA 2025 Internships: Mixed Signal / Circuit Design

On-site 🏒 04 November
R&D, Innovation
California, United States 🇺🇸

Intern, Oncology Epidemiologist

On-site 🏒 08 October
R&D, Innovation
United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Intern - IMAIS - Adaptive Closed-Loop Interaction

Hybrid 🏑🏒 28 October
R&D, Innovation
Massachusetts, United States 🇺🇸

GPU Architecture Engineer - New College Grad 2024

On-site 🏒 08 November
R&D, Innovation
California, United States 🇺🇸 Texas, United States 🇺🇸 North Carolina, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Physical Design Engineer (RDSS Intern)

On-site 🏒 17 October
R&D, Innovation
Hsinchu, Taiwan 🇹🇼

Research Intern - MSR Inclusive Futures Team

Hybrid 🏑🏒 25 October
R&D, Innovation
Washington, United States 🇺🇸

Graphics Architect, Hardware - New College Grad 2025

On-site 🏒 05 November
R&D, Innovation
California, United States 🇺🇸

Applied Deep Learning Research Intern

On-site 🏒 02 December
R&D, Innovation
Helsinki, Finland 🇫🇮 Amsterdam, Netherlands 🇳🇱 Zurich, Switzerland 🇨🇭

Board Design Engineer, LDE - New College Graduate

On-site 🏒 07 May
R&D, Innovation
Shenzhen, China 🇨🇳

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

PCB Layout Engineer - New College Graduate

On-site 🏒 16 October
R&D, Innovation
Shenzhen, China 🇨🇳

Research Fellowship Opportunity

Hybrid 🏑🏒 26 August
R&D, Innovation
Karnataka, India 🇮🇳

NVIDIA 2025 Internships: Hardware Physical Design / VLSI

Remote 🌎🌍🌏 28 August
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸

Research Intern - Algorithms Group: Theory

Hybrid 🏑🏒 06 November
R&D, Innovation
Washington, United States 🇺🇸

Research Intern - Gray Systems Lab

Hybrid 🏑🏒 02 October
R&D, Innovation
Washington, United States 🇺🇸 Wisconsin, United States 🇺🇸 California, United States 🇺🇸

Research Intern - Action Models and Reinforcement Learning

Hybrid 🏑🏒 15 August
R&D, Innovation
New York, United States 🇺🇸

Cambridge Research Intern – Generative Models for Video Games

Hybrid 🏑🏒 18 November
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧

Power Architecture and Optimization Engineer – New College Grad 2024

On-site 🏒 24 September
R&D, Innovation
California, United States 🇺🇸 Texas, United States 🇺🇸

Cambridge Internship Opportunities- Azure Research

Hybrid 🏑🏒 06 November
R&D, Innovation
Cambridgeshire, United Kingdom 🇬🇧

Mixed-Signal Circuit Design Engineer - New College Graduate

On-site 🏒 06 December
R&D, Innovation
Hsinchu, Taiwan 🇹🇼 Taipei, Taiwan 🇹🇼

Power Methodology and Modeling Engineer - New College Grad 2024

On-site 🏒 04 November
R&D, Innovation
California, United States 🇺🇸 Texas, United States 🇺🇸

Barcelona Research Intern – Gray Systems Lab

Hybrid 🏑🏒 08 November
R&D, Innovation
Barcelona, Spain 🇪🇸

Hardware Design Verification Engineering Intern/Co-Op (Undergrad | Summer 2025 | Onsite/Hybrid)

On-site 🏒 17 September
R&D, Innovation
British Columbia, Canada 🇨🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

2025 Co-Op: R&D Packaging

On-site 🏒 29 August
R&D, Innovation
Texas, United States 🇺🇸 New York, United States 🇺🇸 Illinois, United States 🇺🇸

Service Process Innovation & Systems Support (INTERNSHIP)

Hybrid 🏑🏒 08 August
R&D, Innovation
Milano, Italy 🇮🇹

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Intern - AI Networking - SPARC (Strategic Planning and Architecture)

Hybrid 🏑🏒 03 December
R&D, Innovation
Washington, United States 🇺🇸 California, United States 🇺🇸

Research Intern - Innovation Market Analyst Intern

Hybrid 🏑🏒 06 November
R&D, Innovation
Washington, United States 🇺🇸

Research Intern - AI-Assisted Game Creation

Hybrid 🏑🏒 21 November
R&D, Innovation
Washington, United States 🇺🇸 California, United States 🇺🇸

NVIDIA 2025 Internships: Hardware ASIC Design

Remote 🌎🌍🌏 28 August
R&D, Innovation
California, United States 🇺🇸 Remote, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Silicon Solution Intern - 2025

On-site 🏒 21 October
R&D, Innovation
Shanghai, China 🇨🇳

Research Intern - MSR AI Interaction and Learning

Hybrid 🏑🏒 30 October
R&D, Innovation
Washington, United States 🇺🇸

Research Intern - Product Strategy Intern

Hybrid 🏑🏒 18 November
R&D, Innovation
Washington, United States 🇺🇸

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

Research Assistant - PFE 2025

On-site 🏒 10 August
R&D, Innovation
Casablanca, Morocco 🇲🇦

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